TL084CN PDF

The main distinguishing feature of the TL Op-Amp is that they incorporate high-voltage JFET and bipolar transistors which helps the transistor to have very high input impedance and low bias current. Also this Op-Amp has low noise and harmonic distortion making it an ideal choice for audio pre-amplifiers. The TL however is not meant for common 5V operation as it requires a minimum of 7V to operate. If you are curious to learn about few basic application circuits of this IC then you can read through how LM is used since both the IC shares the same applications.

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Each of these JFET-input operational amplifiers incorporates well-matched, high-voltage JFET and bipolar transistors in a monolithic integrated circuit. The devices feature high slew rates, low input bias and offset currents, and low offset-voltage temperature coefficient. Offset adjustment and external compensation options are available within the TL08x family. The I-suffix devices are characterized for operation from?

The Q-suffix devices are characterized for operation from? The M-suffix devices are characterized for operation over the full military temperature range of? Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On all other products, production processing does not necessarily include testing of all parameters. NC VCC? OUT ? C1 IN? Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less. The output may be shorted to ground or to either supply. The package thermal impedance is calculated in accordance with JESD IIB Input bias current?

All characteristics are measured under open-loop conditions with zero common-mode voltage, unless otherwise specified. Input bias currents of an FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in Figure Pulse techniques must be used that maintain the junction temperature as close to the ambient temperature as possible. Input bias current? All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.

Input bias currents of a FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in Figure Pulse techniques must be used that maintain the junction temperatures as close to the ambient temperature as possible.

Figure 1 k? C2 C1 pF IN? VI VI? Maximum Peak Output Voltage? V VOM? Hz TA? Free-Air Temperature? Load Resistance? Supply Voltage? V Figure 9? Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

Large-Signal Differential Voltage Amplification? Hz Figure 12? Differential Voltage Amplification? Total Power Dissipation? Frequency With Feed-Forward Compensation?

Supply Current? V Figure 15 Figure 16? Input Bias Current? Output Voltage? Elapsed Time? Common-Mode Rejection Ratio? Equilvalent Input Noise Voltage? Total Harmonic Distortion? Hz Figure 21 Figure 22? F k? Output B 1N? Audio-Distribution Amplifier Figure NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

Samples may or may not be available. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free RoHS Exempt : This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information.

Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All linear dimensions are in inches millimeters. This drawing is subject to change without notice.

This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.

Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components.

To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.

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